Title:
CURED FILM PRODUCTION METHOD, RESIN COMPOSITION, CURED FILM, LAMINATE BODY PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/080216
Kind Code:
A1
Abstract:
This cured film production method involves: a step for forming a film by applying to a substrate a resin composition that contains a radical polymerizable monomer and at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor; and a step for thermally curing the film in an environment in which the partial pressure of oxygen is 6-150 Pa. A resin composition, cured film, laminate body production method, and semiconductor device manufacturing method are also provided.
Inventors:
FUKUHARA KEI (JP)
YAMAZAKI KENTA (JP)
YAMAZAKI KENTA (JP)
Application Number:
PCT/JP2019/039778
Publication Date:
April 23, 2020
Filing Date:
October 09, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F2/00; C08F2/44; C08F283/04; C08F290/14; C08L79/04; G03F7/027; G03F7/20
Domestic Patent References:
| WO2015118836A1 | 2015-08-13 | |||
| WO2017038664A1 | 2017-03-09 |
Foreign References:
| JP2007233319A | 2007-09-13 | |||
| JP2013063651A | 2013-04-11 | |||
| JP2011133707A | 2011-07-07 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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