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Patent Searching and Data


Title:
CURED PRODUCT, ARTICLE PROVIDED WITH CURED PRODUCT, AND METHOD FOR LESSENING INTERNAL STRESS OF CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/038761
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a cured product having excellent impact resistance. A cured product according to one mode of the present invention is obtained by curing a curable composition containing a (meth)acrylic polymer (A) having, at terminals of the molecule, a group represented by general formula (1) at an average number of at least 0.8 per molecule, an epoxy compound and/or an oxetane compound (B), a photo-radical initiator (C), and an epoxy curing agent (D), and has a thickness of 200 μm or less. (1): -OC(O)C(R1)=CH2 (in the formula, R1 represents a hydrogen atom or an organic group having 1-20 carbon atoms.)

Inventors:
TANAKA HIDENORI (JP)
TAMAI HITOSHI (JP)
YOSHIHASHI KENICHI (JP)
Application Number:
PCT/JP2023/028212
Publication Date:
February 22, 2024
Filing Date:
August 02, 2023
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08G59/18; H05K1/03; H05K3/28
Domestic Patent References:
WO2007077888A12007-07-12
WO2005092981A12005-10-06
Foreign References:
JP2023073098A2023-05-25
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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