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Patent Searching and Data


Title:
CURED PRODUCT, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/190456
Kind Code:
A1
Abstract:
Provided is a cured product that has a surface onto which a marking ink can be easily applied, exhibits excellent adhesiveness with the marking ink after curing, and can form a marker having excellent visibility of characters and symbols on the surface. The cured product comprises a curable resin composition containing a curable resin and an inorganic filler and is characterized in that the inorganic filler contains an amorphous silica, and the average linear expansion coefficient when a cured product having a thickness of 20 µm is subjected to a temperature change from 0ºC to 180ºC is 70-100 ppm/ºC.

Inventors:
ARAI YASUAKI (JP)
YOSHIDA MASATO (JP)
SATO HIROHIDE (JP)
SATO KAZUYA (JP)
HARIMA EIJI (JP)
Application Number:
PCT/JP2023/012395
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
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Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
C08L101/00; C08F2/44; C08F2/46; C08K3/36; C08L63/00; C08L101/08; G03F7/004; G03F7/027; H05K3/28
Domestic Patent References:
WO2014200112A12014-12-18
WO2003032089A12003-04-17
WO2017168699A12017-10-05
WO2014175196A12014-10-30
Foreign References:
JP2009275110A2009-11-26
JP2017529551A2017-10-05
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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