Title:
CURED PRODUCT AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/190393
Kind Code:
A1
Abstract:
The present invention provides a cured product of a photosensitive resin composition, the cured product containing an inorganic filler and still having excellent resolution, while being capable of suppressing warp of a substrate during mounting of an electronic component. The present invention provides a cured product of a photosensitive resin composition which contains at least an alkali-soluble resin, a photopolymerization initiator and an inorganic filler, wherein: the inorganic filler is contained at a ratio of 85% by mass or less relative to the entirety of the photosensitive resin composition; the cured product has an elastic modulus of 4 to 12 GPa; and A and B satisfy A ≤ 0.3% and (B - A) ≤ 0.3, where A (%) is the water absorption of the cured product after being left to stand for 60 minutes in an environment at 25°C and a relative humidity of 10%, and B (%) is the water absorption of the cured product after being left to stand for 60 minutes in an environment at 25°C and a relative humidity of 60%.
Inventors:
TAKAHASHI TSUTOMU (JP)
KATO FUMITAKA (JP)
TOKUMITSU KAYOKO (JP)
ITO NATSUKI (JP)
OKAMOTO DAICHI (JP)
SHIMURA MASAYUKI (JP)
KATO FUMITAKA (JP)
TOKUMITSU KAYOKO (JP)
ITO NATSUKI (JP)
OKAMOTO DAICHI (JP)
SHIMURA MASAYUKI (JP)
Application Number:
PCT/JP2023/012305
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
G03F7/004; G03F7/031; G03F7/075; H05K1/03
Foreign References:
| JP2019179202A | 2019-10-17 | |||
| JP2012062359A | 2012-03-29 | |||
| JP2012062358A | 2012-03-29 | |||
| JP2018172632A | 2018-11-08 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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