Title:
CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/050041
Kind Code:
A1
Abstract:
Provided are a cured product production method whereby a cured product having excellent breaking elongation is obtained even when cured at a low temperature, a laminate production method including said cured product production method, and an electronic device production method including said cured product production method and said laminate production method. The cured product production method comprises a film-forming step of applying a specific photosensitive resin composition onto a base material and forming a film, an exposure step, a development step using a development solution containing at least one compound selected from the group consisting of a base and a base generator, and a heating step, the water content in the development solution relative to the total mass thereof being 50 mass% or less.
Inventors:
SHIMADA KAZUTO (JP)
SATO NAOKI (JP)
NOZAKI ATSUYASU (JP)
AOSHIMA TOSHIHIDE (JP)
NIHASHI WATARU (JP)
SATO NAOKI (JP)
NOZAKI ATSUYASU (JP)
AOSHIMA TOSHIHIDE (JP)
NIHASHI WATARU (JP)
Application Number:
PCT/JP2021/030027
Publication Date:
March 10, 2022
Filing Date:
August 17, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/20; G03F7/027; G03F7/30; G03F7/32; G03F7/40
Domestic Patent References:
| WO2012176694A1 | 2012-12-27 |
Foreign References:
| JP2003255535A | 2003-09-10 | |||
| JP2004124054A | 2004-04-22 | |||
| JP2004046217A | 2004-02-12 | |||
| JP2009271155A | 2009-11-19 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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