Title:
CURED RESIN FORMATION METHOD AND CURED RESIN FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/019718
Kind Code:
A1
Abstract:
This cured resin formation method includes an application step for applying a UV-curing resin to a base and a curing step for curing the UV-curing resin by irradiating the UV-curing resin applied in the application step with UV rays, the curing step being such that the UV-curing resin is irradiated with UV rays during cooling of the UV-curing resin so that the difference between the normal temperature of the UV-curing resin and the temperature during UV ray irradiation falls within a preset set temperature difference.
Inventors:
TAKEUCHI TASUKU (JP)
TOMINAGA RYOJIRO (JP)
TOMINAGA RYOJIRO (JP)
Application Number:
PCT/JP2019/029992
Publication Date:
February 04, 2021
Filing Date:
July 31, 2019
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
B29C64/124; B29C64/30; B33Y10/00; B33Y30/00
Domestic Patent References:
| WO2017221347A1 | 2017-12-28 | |||
| WO2016075823A1 | 2016-05-19 |
Foreign References:
| JP2014221538A | 2014-11-27 | |||
| JP2019081958A | 2019-05-30 | |||
| JP2013067016A | 2013-04-18 |
Other References:
See also references of EP 4005776A4
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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