CURING AGENTS FOR EPOXY RESINS - DESIGNER MOLECULES INC

Title:

CURING AGENTS FOR EPOXY RESINS

Document Type and Number:

WIPO Patent Application WO/2011/116050

Kind Code:

A3

Abstract:

The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.

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Inventors:

DERSHEM STEPHEN M (US)

Application Number:

PCT/US2011/028606

Publication Date:

April 12, 2012

Filing Date:

March 16, 2011

Export Citation:

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Assignee:

DESIGNER MOLECULES INC (US)
DERSHEM STEPHEN M (US)

International Classes:

C07D233/61; C07D233/58; C07D403/06; C08G59/40; C08K5/3445; C08L63/00; C09D163/00

Domestic Patent References:

WO2010018198A1	2010-02-18
WO2008151437A1	2008-12-18
WO2004098625A2	2004-11-18

Attorney, Agent or Firm:

BABIN, Jane (PCc/o Intellevate,PO Box 52050,USPTO Customer No. 7100, Minneapolis Minnesota, US)

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