Title:
CURING COMPOSITION AND METHOD FOR PRODUCING CURING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/012426
Kind Code:
A1
Abstract:
A curing composition is disclosed which is excellent in workability, adhesiveness, rubber properties, shelf life stability, and fast curing properties. The curing composition contains (A) a crosslinkable silyl group-containing organic polymer and (B) a (meth)acrylic polymer which is obtained by polymerizing a (meth)acrylic monomer having a polymerizable unsaturated bond in the presence of a metallocene compound and a crosslinkable silyl group-containing thiol compound, and at least one end of which is bonded with a residue -S-R3 (wherein R3 is a group having a crosslinkable silyl group) which is left when a hydrogen atom is removed from the crosslinkable silyl group-containing thiol compound.
Inventors:
SAITO ATSUSHI (JP)
SAITO TOMONORI (JP)
OKAMURA NAOMI (JP)
SAITO TOMONORI (JP)
OKAMURA NAOMI (JP)
Application Number:
PCT/JP2004/010909
Publication Date:
February 10, 2005
Filing Date:
July 30, 2004
Export Citation:
Assignee:
CEMEDINE CO LTD (JP)
SAITO ATSUSHI (JP)
SAITO TOMONORI (JP)
OKAMURA NAOMI (JP)
SAITO ATSUSHI (JP)
SAITO TOMONORI (JP)
OKAMURA NAOMI (JP)
International Classes:
C08G65/336; C08K5/00; C08L43/04; (IPC1-7): C08L33/14; C08L15/00; C08L71/02; C08K5/54
Foreign References:
| JP2001040037A | 2001-02-13 | |||
| JP2003048924A | 2003-02-21 | |||
| JPH0733993A | 1995-02-03 | |||
| JPH0665464A | 1994-03-08 |
Other References:
See also references of EP 1650257A4
Attorney, Agent or Firm:
Ishihara, Shoji c/o Ishihara International Patent Firm (No. 302 Wakai Bldg. 7-8, Higashi-Ikebukuro
3-chome, Toshima-k, Tokyo 13, JP)
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