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Title:
CURING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2004/099318
Kind Code:
A1
Abstract:
A curing composition which exhibits practical curability and good adhesiveness even when a non-organic tin compound is used as a curing agent is disclosed. The curing composition is characterized by containing (A) an organic polymer having a silicon-containing group which can be crosslinked by forming a siloxane bond, (B) a metal carboxylate and/or a carboxylic acid, and (C) a silicon compound having a heteroatom on the carbon atom in the &agr -position or β-position to the silicon.

Inventors:
WAKABAYASHI KATSUYU (JP)
OKAMOTO TOSHIHIKO (JP)
ANDO HIROSHI (JP)
Application Number:
PCT/JP2004/005954
Publication Date:
November 18, 2004
Filing Date:
April 23, 2004
Export Citation:
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Assignee:
KANEKA CORP (JP)
WAKABAYASHI KATSUYU (JP)
OKAMOTO TOSHIHIKO (JP)
ANDO HIROSHI (JP)
International Classes:
C08K5/09; C08K5/54; C08L101/10; C08L43/04; (IPC1-7): C08L101/10; C08K5/09; C08K5/098; C08K5/17; C08K5/54
Domestic Patent References:
WO2003014226A12003-02-20
Foreign References:
JPH04292616A1992-10-16
JPH03197548A1991-08-28
JPH02289642A1990-11-29
JPS559669A1980-01-23
JP3062626B22000-07-12
JPH06322251A1994-11-22
JP2000345054A2000-12-12
EP1041119A22000-10-04
JPH05117519A1993-05-14
JPS6235421A1987-02-16
JPH01168764A1989-07-04
JP2000186176A2000-07-04
JPS5978223A1984-05-07
JPS59168014A1984-09-21
JPS60228516A1985-11-13
JPS60228517A1985-11-13
Other References:
See also references of EP 1624027A4
Attorney, Agent or Firm:
KANEKA CORPORATION (kita-ku Osaka-shi, Osaka 88, JP)
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