Title:
CURING COMPOUND
Document Type and Number:
WIPO Patent Application WO/2018/107453
Kind Code:
A1
Abstract:
Provided in the present invention is a curing compound having good solvent solubility and being able to form a cured product having ultra-high heat resistance. The curing compound of the present invention is expressed by the following formula (1). In formula (1), R1 and R2 represent a curing functional group, and D1 and D2 represent a single bond or a linking group. L represents a divalent group having a repeating unit, the repeating unit comprising a structure represented by the following formula (I) and a structure represented by the following formula (II) (in the formulae, Ar1-Ar3 represent a group having two hydrogen atoms removed from the structural formula of the aromatic ring, or a group formed by removing two hydrogen atoms from a structural formula formed by bonding more than two aromatic rings using a single bond or a connecting group. X represents -CO-, -S- or -SO2- and Y represents -S-, -SO2-, -O-, -CO-, -COO- or -CONH-. N represents an integer of greater than zero).
Inventors:
YANG FEI (CN)
OKANO YOSHIMICHI (JP)
NAKATANI KOUJI (JP)
OKANO YOSHIMICHI (JP)
NAKATANI KOUJI (JP)
Application Number:
PCT/CN2016/110302
Publication Date:
June 21, 2018
Filing Date:
December 16, 2016
Export Citation:
Assignee:
DAICEL CORP (JP)
YANG FEI (CN)
YANG FEI (CN)
International Classes:
C08G73/10; C07C231/02; C07C233/27
Foreign References:
| US7897715B1 | 2011-03-01 | |||
| CN103987770A | 2014-08-13 | |||
| CN101421356A | 2009-04-29 | |||
| CN101602704A | 2009-12-16 | |||
| CN1424340A | 2003-06-18 | |||
| RU2585281C1 | 2016-05-27 | |||
| US20080299402A1 | 2008-12-04 |
Other References:
QU ET AL: "Study on Bismaleimide Resin Containing Ether and Ketone Groups Modified by Diallyl Bisphenol A", ENGINEERING PLASTICS APPLICATION, vol. 41, no. 8, 31 August 2013 (2013-08-31), pages 83 - 88
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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