Title:
CURING DEVICE AND METHOD FOR PRODUCING SOLDER RESIST
Document Type and Number:
WIPO Patent Application WO/2017/169624
Kind Code:
A1
Abstract:
Provided is a curing device for curable compositions, which is capable of suppressing deterioration in adhesion of a cured coating film and discoloration of a surface layer part of the cured coating film.
A curing device 1 according to the present invention comprises: a support means 4 which supports a light-transmitting base; an inkjet head 5 which has a nozzle 6 that is arranged so as to face a first surface 2a of the base 2 supported by the support means 4, and which ejects a curable composition from the nozzle 6 toward the first surface 2a of the base 2; a first light source 7 which is arranged adjacent to the inkjet head 5 so as to face the first surface 2a of the base 2; and a second light source 8 which is arranged so as to face a second surface 2b of the base 2.
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Inventors:
YOSHIKAWA RINA (JP)
YOSHIDA MASATO (JP)
SHIMURA MASAYUKI (JP)
MATSUMOTO HIROSHI (JP)
YOSHIDA MASATO (JP)
SHIMURA MASAYUKI (JP)
MATSUMOTO HIROSHI (JP)
Application Number:
PCT/JP2017/009454
Publication Date:
October 05, 2017
Filing Date:
March 09, 2017
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
B05C9/12; B05C5/00; B05D3/06; B05D7/24; H05K3/28
Foreign References:
| JP2012143940A | 2012-08-02 | |||
| JP2009132151A | 2009-06-18 | |||
| JP2014133864A | 2014-07-24 | |||
| JP2013091788A | 2013-05-16 | |||
| JP2004314304A | 2004-11-11 | |||
| JP2005104108A | 2005-04-21 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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