Title:
CURING DEVICE FOR RESIN COMPOSITE MATERIAL, CURING METHOD, AND MOLDED RESIN ARTICLE
Document Type and Number:
WIPO Patent Application WO/2016/194676
Kind Code:
A1
Abstract:
In order to use a laser to cure a resin composite material to a high strength with simple equipment, this curing device (1) is provided with: a pressing body (4) which is formed from a material that transmits a laser beam (L) (quartz glass, for example) and which, when pressed against the surface of an uncured resin composite material (2), applies pressure on the resin composite material (2); and a laser beam supply unit (5) which irradiates a laser beam (L) through the pressing body (4) onto the uncured resin composite material (2). This curing device is further provided with an irradiation position adjustment unit (6) which, within the area pressed by the pressing body (4), moves the position irradiated by the laser beam (L) supplied from the laser beam supply unit (5).
Inventors:
KAMIHARA NOBUYUKI (JP)
ABE TOSHIO (JP)
ABE TOSHIO (JP)
Application Number:
PCT/JP2016/065167
Publication Date:
December 08, 2016
Filing Date:
May 23, 2016
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C35/08; B29C65/14; B29C70/06
Foreign References:
| JP2013238791A | 2013-11-28 | |||
| JP2005081396A | 2005-03-31 | |||
| JP2004148732A | 2004-05-27 | |||
| JP2010125654A | 2010-06-10 |
Other References:
See also references of EP 3260263A4
Attorney, Agent or Firm:
FUJITA, TAKAHARU (JP)
Takaharu Fujita (JP)
Takaharu Fujita (JP)
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