Title:
CURVED SURFACE ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/062423
Kind Code:
A1
Abstract:
The invention provides a curved surface array substrate, comprising a substrate, a first metal layer arranged on the substrate, an insulating layer arranged on the substrate and covering the first metal layer, a semi-conductor layer arranged on the insulating layer, and a second metal layer arranged on the insulating layer and connected with the semi-conductor layer; a through hole is provided on the insulating layer close to the center of the curve, and the second metal layer is connected with the first metal layer by means of the through hole.
Inventors:
YIN BINGKUN (CN)
Application Number:
PCT/CN2018/113350
Publication Date:
April 02, 2020
Filing Date:
November 01, 2018
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L27/12; G02F1/1362; H01L21/84
Foreign References:
| CN107799538A | 2018-03-13 | |||
| CN2922126Y | 2007-07-11 | |||
| CN105826350A | 2016-08-03 | |||
| US20180076236A1 | 2018-03-15 |
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
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