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Title:
CURVED SURFACE BONDING APPARATUS AND CURVED SURFACE BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/090627
Kind Code:
A1
Abstract:
A curved surface bonding apparatus (10) and a curved surface bonding method, for use in bonding a substrate (20) and a flexible film material (30). The substrate (20) comprises a bonding surface (22) for bonding the flexible film material (30), and the bonding surface (22) comprises a curved surface portion (222). A bonding apparatus (146) comprises a first roller (1461) for rolling the flexible film material (30) onto the substrate (20) to bond the flexible film material (30) onto the substrate (20), and further comprises a second roller (1463) for rolling the flexible film material (30) onto the substrate (20) when the first roller (1461) rolls to a position corresponding to the curved surface portion (222). Thus, the substrate (20) can be prevented from falling off from a substrate platform (12) by a lateral force when the first roller (1461) rolls to the position corresponding to the curved surface portion (222), thereby improving the bonding quality.

Inventors:
ZENG, Lu (Building #43, Dayun Software Town No. 8288 Longgang Road, Henggang Street, Longgang Distric, Shenzhen Guangdong 2, 518172, CN)
Application Number:
CN2017/110258
Publication Date:
May 16, 2019
Filing Date:
November 09, 2017
Export Citation:
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Assignee:
SHENZHEN ROYOLE TECHNOLOGIES CO. , LTD. (Building #43, Dayun Software Town No. 8288 Longgang Road, Henggang Street, Longgang Distric, Shenzhen Guangdong 2, 518172, CN)
International Classes:
B32B37/10
Foreign References:
CN104309264A2015-01-28
CN204895948U2015-12-23
CN103287050A2013-09-11
CN104471630A2015-03-25
CN101727249A2010-06-09
KR20170006038A2017-01-17
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (Room 301 Trade Building, ZhaolanyuanTsinghua University, Qinghuayuan, Haidian District, Beijing 4, 100084, CN)
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