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Title:
CUSHIONING MATERIAL FOR HOT PRESSING AND PROCESS FOR PRODUCING LAYERED BOARD
Document Type and Number:
WIPO Patent Application WO/2003/039832
Kind Code:
A1
Abstract:
A cushioning material for hot pressing which has a nonwoven fabric made of a fiber mixture comprising fibers (A) and fibers (B) so as to improve both cushioning properties and thermal conductivity, wherein the fibers (A) are aromatic polyamide fibers and the fibers (B) are fibers having a coefficient of thermal conductivity in the lengthwise direction of 10 W&sol (m·K) or higher, a decomposition initiation temperature of 350°C or higher, an initial tensile resistance of 1,000 g&sol d or higher, and an electrical resistivity of 1010 &ohm ·cm or higher.

Inventors:
YOSHIDA AKIRA (JP)
Application Number:
PCT/JP2002/010024
Publication Date:
May 15, 2003
Filing Date:
September 25, 2002
Export Citation:
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Assignee:
YAMAUCHI CORP (JP)
YOSHIDA AKIRA (JP)
International Classes:
B32B5/06; B29C43/00; B29C43/20; B29C43/32; B30B15/06; B32B5/26; D04H1/00; D04H13/00; B29L7/00; B29L9/00; H05K3/02; H05K3/46; (IPC1-7): B29C43/20; B29C43/32
Foreign References:
JP2002326302A2002-11-12
JP2002061057A2002-02-28
EP1030543A12000-08-23
EP1270193A12003-01-02
EP1433583A12004-06-30
Other References:
See also references of EP 1462233A4
Attorney, Agent or Firm:
Itoh, Hidehiko (Kyowa Shimanouchi Bldg. 21-19, Shimanouchi 1-chome, Chuo-k, Osaka-shi Osaka, JP)
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