Title:
CUT-OFF METHOD FOR UNDERGROUND STRUCTURE AND PLANAR CUT-OFF MATERIAL
Document Type and Number:
WIPO Patent Application WO/2002/008526
Kind Code:
A1
Abstract:
A planar cut-off material capable of withstanding temporary rain falls during a construction and ensuring a high cut-off performance by bringing cut-off compositions into direct contact with each other at joint portions to integrate a plurality of planar cut-off materials together, and a cut-off method for an underground structure. A plurality of sheets of planar cut-off materials (1), each comprising a water-swelling cut-off composition (2) formed in a sheet- or panel-shape, are pasted over the entire surface of an object so as to overlap at respective ends (11). When pasting planar cut-off materials (1), water-swelling cut-off compositions (2) are exposed at the joint portions (9) to allow the compositions (2) to contact directly with each other between a lower-layer cut-off material (1) and an upper-layer cut-off material (1) to thereby form an integrated cut-off composition layer.
Inventors:
KARATSU TOSHIAKI (JP)
NAKAMURA TAKESHI (JP)
KAWAGUCHI YUJI (JP)
HASEGAWA KOHEI (JP)
NAKAMURA TAKESHI (JP)
KAWAGUCHI YUJI (JP)
HASEGAWA KOHEI (JP)
Application Number:
PCT/JP2000/004876
Publication Date:
January 31, 2002
Filing Date:
July 21, 2000
Export Citation:
Assignee:
KUNIMINE IND CO LTD (JP)
TOMOE KOGYO KK (JP)
KARATSU TOSHIAKI (JP)
NAKAMURA TAKESHI (JP)
KAWAGUCHI YUJI (JP)
HASEGAWA KOHEI (JP)
TOMOE KOGYO KK (JP)
KARATSU TOSHIAKI (JP)
NAKAMURA TAKESHI (JP)
KAWAGUCHI YUJI (JP)
HASEGAWA KOHEI (JP)
International Classes:
E02D31/02; (IPC1-7): E02D31/02
Foreign References:
| JPH04119833U | 1992-10-27 | |||
| JPH06137094A | 1994-05-17 | |||
| US5580630A | 1996-12-03 | |||
| JPH07247570A | 1995-09-26 |
Attorney, Agent or Firm:
Takeda, Kenichi (Nishishinbashi 1-chome Minato-ku Tokyo, JP)
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