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Patent Searching and Data


Title:
CUT PANEL HAVING PROTECTION CIRCUIT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/017597
Kind Code:
A1
Abstract:
According to a cut panel having a protection circuit and a manufacturing method therefor of the present invention, a protection circuit is configured by processing a TFT backplane cut by using laser trimming, thereby being capable of fundamentally preventing defects caused by external ESD or defects caused by charges accumulated in a circuit or resin due to an overcurrent/overvoltage.

Inventors:
LEE WON GYU (KR)
LEE KYUNG HA (KR)
JEONG YOUNG TAE (KR)
Application Number:
KR2018/006997
Publication Date:
January 24, 2019
Filing Date:
June 21, 2018
Export Citation:
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Assignee:
TOVIS CO LTD (KR)
International Classes:
G02F1/1333
Foreign References:
KR20140095621A2014-08-04
KR20110099477A2011-09-08
KR20140069673A2014-06-10
KR20050069023A2005-07-05
KR20050011296A2005-01-29
Attorney, Agent or Firm:
DOOSUNG PATENT LAW FIRM (KR)
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