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Patent Searching and Data


Title:
CUT PRODUCT PRODUCTION METHOD AND CUTTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2016/013833
Kind Code:
A1
Abstract:
The present invention relates to a cut product production method and a cutting system, and according to one aspect of the present invention, provided is a cut product production method, comprising the steps of: producing a defect distribution map of a material on the basis of defect information on the material; and dividing the defect distribution map of a material along a cutting line of the material so as to generate a plurality of defect distribution maps corresponding to respective regions of the cut material.

Inventors:
LEE, Kyu Hwang (LG Chem Research Park, 188, Munji-ro,,Yuseong-gu, Daejeon 305-738, 305-738, KR)
LEE, Ho Kyung (LG Chem Research Park, 188, Munji-ro,,Yuseong-gu, Daejeon 305-738, 305-738, KR)
Application Number:
KR2015/007518
Publication Date:
January 28, 2016
Filing Date:
July 21, 2015
Export Citation:
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Assignee:
LG CHEM, LTD. (128, Yeoui-daero,Yeongdeungpo-gu, Seoul 150-721, 150-721, KR)
International Classes:
B65H26/02; B65H35/00; B65H37/00; B65H43/04
Foreign References:
KR20080033863A2008-04-17
KR101179071B12012-09-03
KR100991258B12010-11-03
KR100863163B12008-10-13
KR101315102B12013-10-07
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (5th Floor, New Wing Gwangsung Bldg.,,11, Yeoksam-ro 3-gil,,Gangnam-gu, Seoul 135-936, 135-936, KR)
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