Title:
CUT SHEET AND METHOD FOR SUPPRESSING CUTTING FLAWS
Document Type and Number:
WIPO Patent Application WO/2017/138568
Kind Code:
A1
Abstract:
Provided are a cut sheet whereby adequate water resistance is provided and few sharp projections occur on an end surface thereof even when the cut sheet includes a large amount of inorganic particles, and a method for suppressing cutting flaws. The cut sheet according to the present invention is molded from a resin composition including at least 50% by mass of inorganic particles and a thermoplastic resin with respect to the entire mass of the composition, the water absorption of the cut sheet as measured in accordance with JIS K-7209 being 10% or lower, and the actual ratio of the exposed surface area of at least one end surface of the cut sheet occupied by inorganic particles being at least 2% lower than the theoretical ratio of the surface area occupied by inorganic particles.
Inventors:
SUMI YUICHIRO (JP)
Application Number:
PCT/JP2017/004591
Publication Date:
August 17, 2017
Filing Date:
February 08, 2017
Export Citation:
Assignee:
TBM CO LTD (JP)
International Classes:
C08J9/00; B26D3/00; C08J5/18
Domestic Patent References:
| WO2014109267A1 | 2014-07-17 | |||
| WO2012165311A1 | 2012-12-06 |
Foreign References:
| JP2015062966A | 2015-04-09 | |||
| JPS4832176A | 1973-04-27 | |||
| JPH11277623A | 1999-10-12 | |||
| JPH10157745A | 1998-06-16 |
Other References:
See also references of EP 3415557A4
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
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