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Patent Searching and Data


Title:
CUTTER FOR MACHINING FILM END FACES, AND MACHINING APPARATUS PROVIDED THEREWITH, AS WELL AS METHOD OF MACHINING FILM END FACES
Document Type and Number:
WIPO Patent Application WO/2011/040639
Kind Code:
A1
Abstract:
Disclosed is a cutter (100) equipped with a rotation body (10) and a plurality of cutting sections (1a - 1f) which are provided on a mounting surface (S) that is perpendicular to a rotation axis (A) of the rotation body (10). The cutting sections (1a - 1f) protrude from the mounting surface (S). The cutting sections (1a - 1f) each have a top surface. A cutting blade is formed at least on one side of the top surface. The cutting blade is provided in such a way as to be inclined within a range from 20 degrees to 35 degrees in the rotational direction of the rotation axis (A), provided that a straight line passing through the rotation axis (A) and the end of the cutting blade that faces the rotation axis (A) is taken as a reference line, with the cutting blade seen from the vertical direction with respect to the mounting surface. In the case of the cutter (100) and of a method of machining end faces using the same, it is possible to perform cutting without causing chipping or other damage to film end faces, and it is possible to machine a large number of film end faces.

Inventors:
KATAOKA TATSUYA (JP)
NISHIBARA TADASHI (JP)
KATSUDA SUMIO (JP)
Application Number:
PCT/JP2010/067497
Publication Date:
April 07, 2011
Filing Date:
September 29, 2010
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
KATAOKA TATSUYA (JP)
NISHIBARA TADASHI (JP)
KATSUDA SUMIO (JP)
International Classes:
B23C3/12; B23C3/00; B23C5/06; B23C5/08; G02B5/30
Foreign References:
JP2002192415A2002-07-10
JP2003300168A2003-10-21
JP2008260077A2008-10-30
JP2003220512A2003-08-05
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
Nakayama δΊ¨ (JP)
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