Title:
CUTTER AND METHOD FOR CUTTING BRITTLE MATERIAL SUBSTRATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2010/087423
Kind Code:
A1
Abstract:
Provided is a cutter which can reliably form a diagonal crack further in the direction of the thickness of a brittle material substrate. The cutter has a shape wherein the congruent bottom surfaces of the two circular cones or two circular truncated cones sharing a rotating axis (22) are bonded and the circumferential portion of the bottom surfaces is formed as a blade edge ridge line (21). On the blade edge ridge line (21), grooves (23) tilted by a predetermined angle with respect to the rotating axis direction are formed at predetermined intervals in the circumferential direction. Furthermore, angles (blade angle (θ1), blade angle (θ2)) formed by the side surfaces of the two circular cones or those of the circular truncated cones and the bottom surfaces are different from each other.
Inventors:
TOMINAGA, Keisuke (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
富永 圭介 (〒44 大阪府吹田市南金田２丁目１２番１２号 三星ダイヤモンド工業株式会社内 Osaka, 〒5640044, JP)
富永 圭介 (〒44 大阪府吹田市南金田２丁目１２番１２号 三星ダイヤモンド工業株式会社内 Osaka, 〒5640044, JP)
Application Number:
JP2010/051184
Publication Date:
August 05, 2010
Filing Date:
January 29, 2010
Export Citation:
Assignee:
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (2-12-12, Minami-Kaneden Suita-cit, Osaka 44, 〒5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 〒5640044, JP)
TOMINAGA, Keisuke (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 〒5640044, JP)
TOMINAGA, Keisuke (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
International Classes:
C03B33/10; B28D1/24; B28D5/04; C03B33/04
Attorney, Agent or Firm:
KASHIMA, Yoshio (409 Yuni Higashi-Umeda 7-2, Minami Ogi-machi, Kita-ku, Osaka-cit, Osaka 52, 〒5300052, JP)