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Patent Searching and Data


Title:
CUTTING APPARATUS AND FILM LAMINATE CHAMFERING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/172602
Kind Code:
A1
Abstract:
The present invention relates to a cutting apparatus and a film laminate chamfering method using same. An aspect of the present invention can reduce micro-cracks generated on a film laminate when a curved surface of the film laminate is chamfered, can reduce maximum stress applied to the film laminate, can prevent lifting, and can perform a curved surface process so that a deformed-cut product can be produced.

Inventors:
KIM, Young Tae (LG Chem Research Park, 188, Munji-ro,,Yuseong-gu, Daejeon, 34122, KR)
PARK, Seul Ki (LG Chem Research Park, 188, Munji-ro,,Yuseong-gu, Daejeon, 34122, KR)
LIM, Bum Seung (LG Chem Research Park, 188, Munji-ro,,Yuseong-gu, Daejeon, 34122, KR)
YANG, Do Weon (LG Chem Research Park, 188, Munji-ro,,Yuseong-gu, Daejeon, 34122, KR)
HONG, Yu Shik (LG Chem Research Park, 188, Munji-ro,,Yuseong-gu, Daejeon, 34122, KR)
Application Number:
KR2019/002506
Publication Date:
September 12, 2019
Filing Date:
March 05, 2019
Export Citation:
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Assignee:
LG CHEM, LTD. (128, Yeoui-daero,Yeongdeungpo-gu, Seoul, 07336, KR)
International Classes:
B26D3/02; B26D1/00; B26D5/06; B26D7/20
Foreign References:
CN101104246A2008-01-16
KR19990022706U1999-07-05
KR20170006040A2017-01-17
CN102990731A2013-03-27
KR20140125173A2014-10-28
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (5th Floor, New Wing Gwangsung Bldg.,,11, Yeoksam-ro 3-gil,,Gangnam-gu, Seoul, 06242, KR)
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