Title:
CUTTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/208686
Kind Code:
A1
Abstract:
Provided is a cutting apparatus (1) that cuts a workpiece (ZE) by laser light (CW, PW). The cutting apparatus (1) is provided with a pulse-wave laser light oscillator (10) that oscillates pulse-wave laser light (PW) and a continuous-wave laser light oscillator (11) that oscillates continuous-wave laser light (CW), wherein a first portion composed of a first material (M) of the workpiece (ZE) is cut by the pulse-wave laser light (PW), and a second portion which is composed of a second material (A) different from the first material (M) of the workpiece (ZE) is cut by the continuous-wave laser light (CW).
Inventors:
GODA YASUYUKI (JP)
ASAI SHINYA (JP)
NISHIHARA HIROYASU (JP)
ASAI SHINYA (JP)
NISHIHARA HIROYASU (JP)
Application Number:
PCT/JP2016/068717
Publication Date:
December 29, 2016
Filing Date:
June 23, 2016
Export Citation:
Assignee:
TOYOTA JIDOSHOKKI KK (JP)
International Classes:
B23K26/38; B23K26/082; H01G13/00; H01M4/04; H01M4/139
Domestic Patent References:
| WO2013051401A1 | 2013-04-11 |
Foreign References:
| JP2013119095A | 2013-06-17 | |||
| JPH0371987A | 1991-03-27 | |||
| JP2015139820A | 2015-08-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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