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Patent Searching and Data


Title:
CUTTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/031421
Kind Code:
A1
Abstract:
To provide a cutting apparatus in which the position of the edge of a cutting blade during cutting processing can be adjusted more appropriately than in the prior art. A control part of a cutting apparatus acquires cutting data (S1), and sets a pressure value corresponding to the pressure applied to a mounting part by a pressure changing mechanism during cutting processing for cutting an object to be cut, and the target range of the position of the mounting part in a third direction, in accordance with the cutting data (S9). The control part controls the pressure changing mechanism in accordance with the pressure value, controls a first movement mechanism in accordance with the cutting data while applying the pressure to the mounting part, and executes cutting processing for cutting an object to be cut by a cutting blade mounted to the mounting part (S10). In a period in which cutting processing is being executed, the control part acquires the position of the mounting part in the third direction, and when the acquired position is not within the target range, the control part changes the set pressure value, and controls the pressure changing mechanism on the basis of the changed pressure value and causes cutting processing to be executed (S10).

Inventors:
SUGIYAMA KENTARO (JP)
Application Number:
PCT/JP2019/012758
Publication Date:
February 13, 2020
Filing Date:
March 26, 2019
Export Citation:
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Assignee:
BROTHER IND LTD (JP)
International Classes:
B26D7/26; B26D5/00
Foreign References:
JP2014008557A2014-01-20
JPH02116497A1990-05-01
JP2002127092A2002-05-08
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