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Title:
CUTTING DEVICE, AND CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2008/015895
Kind Code:
A1
Abstract:
A fine wire (24) tensed and having fixed abrasive grains is run in one direction at a high speed. Moreover, a resin-sealed object (17) fixed on a left-hand stage (21) and a right-hand stage (22) and the fine wire (24) are moved relative to each other. As a result, the fine wire (24) and the resin-sealed object (17) are made to contact thereby to cut the resin-sealed object (17). In one row region belonging to the resin-sealed object (17), a vertical portion (WV) or a portion of the fine wire (24) moves at first in a bent shape along a cutting line (12C) having a curved or broken line, thereby to cut the resin-sealed object (17). Next, the vertical portion (WV) moves linearly along a cutting line (12S) having only a straight line (or line segment), thereby to cut the resin-sealed object (17). As a result, each region contained in the row region is divided into individual packages.

Inventors:
MAEDA, Keiji (5 Kamitoba Kamichoshi-cho,Minami-ku, Kyoto-shi, Kyoto 05, 6018105, JP)
前田 啓司 (〒05 京都府京都市南区上鳥羽上調子町5番地 TOWA株式会社内 Kyoto, 6018105, JP)
KITADA, Ryoji (5 Kamitoba Kamichoshi-cho,Minami-ku, Kyoto-shi, Kyoto 05, 6018105, JP)
北田 良二 (〒05 京都府京都市南区上鳥羽上調子町5番地 TOWA株式会社内 Kyoto, 6018105, JP)
Application Number:
JP2007/063893
Publication Date:
February 07, 2008
Filing Date:
July 12, 2007
Export Citation:
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Assignee:
TOWA CORPORATION (5 Kamitoba Kamichoshi-cho, Minami-ku Kyoto-shi, Kyoto 05, 6018105, JP)
TOWA株式会社 (〒05 京都府京都市南区上鳥羽上調子町5番地 Kyoto, 6018105, JP)
MAEDA, Keiji (5 Kamitoba Kamichoshi-cho,Minami-ku, Kyoto-shi, Kyoto 05, 6018105, JP)
前田 啓司 (〒05 京都府京都市南区上鳥羽上調子町5番地 TOWA株式会社内 Kyoto, 6018105, JP)
KITADA, Ryoji (5 Kamitoba Kamichoshi-cho,Minami-ku, Kyoto-shi, Kyoto 05, 6018105, JP)
International Classes:
H01L21/56; B24B27/06
Attorney, Agent or Firm:
FUKAMI, Hisao et al. (Fukami Patent Office, Nakanoshima Central Tower 22nd Floor,2-7, Nakanoshima 2-chome, Kita-k, Osaka-shi Osaka 05, 5300005, JP)
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