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Patent Searching and Data


Title:
CUTTING DEVICE AND CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/016038
Kind Code:
A1
Abstract:
The cutting device according to the present embodiment is for cutting a plate-shaped member obtained by affixing a plate-shaped first member and second member to each other, wherein the cutting device is provided with: a first cutting part, which comes into contact with a first processing surface of the first member on the opposite side from the surface facing the second member and moves, thereby forming a first cutting groove extending in the movement direction on the first processing surface; one or more first movement parts, which move together with the movement of the first cutting part and move in the movement direction while being in contact with the first processing surface; a second cutting part, which comes into contact with a second processing surface of the second member on the opposite side from the surface facing the first member and moves in the movement direction, and thereby forms a second cutting groove extending in the movement direction on the second processing surface; and one or more second movement parts, which move together with the movement of the second cutting part and move in the movement direction while being in contact with the second processing surface. The first cutting part and one of the second movement parts face each other across the plate-shaped member, and the second cutting part and one of the first movement parts face each other across the plate-shaped member.

Inventors:
ISHIDA, Kohji (1 Takumicho, Sakai-ku, Sakai-sh, Osaka 22, 〒5908522, JP)
Application Number:
JP2016/071313
Publication Date:
January 25, 2018
Filing Date:
July 20, 2016
Export Citation:
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Assignee:
SAKAI DISPLAY PRODUCTS CORPORATION (1 Takumicho, Sakai-ku Sakai-sh, Osaka 22, 〒5908522, JP)
International Classes:
B26D1/22; B26D1/18; C03B33/07
Attorney, Agent or Firm:
KOHNO, Hideto et al. (KOHNO & KOHNO, 4-3 Tsuriganecho 2-chome, Chuo-ku, Osaka-sh, Osaka 35, 〒5400035, JP)
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