Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CUTTING DEVICE AND PLY CUTTING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/154344
Kind Code:
A1
Abstract:
A ply for a tire is accurately cut off. Provided is a cutting device 1 for cutting off a ply 10 for a tire in which a plurality of codes 12 arranged in parallel at regular intervals is covered with unvulcanized topping rubber 14. The cutting device 1 is provided with: an interval expanding means 2 for pressing the ply 10 from a side of a second surface 10b to a side of a first surface 10a to stretch the ply 10 to the side of the first surface 10a and expand the interval of the codes 12; and a ply cutting means 3 for cutting off a stretched part of the ply 10 along the codes 12, the ply cutting means 3 being disposed on the side of the first surface 10a of the ply 10.

More Like This:
WO/2022/229560DEVICE AND METHOD FOR CUTTING AN INTERMEDIATE PRODUCT MADE OF RUBBER
JP2002516198[Title of the Invention] A method for cutting a component of an elastomer
JP6597853Cutting device and method for corded rubber sheet members
Inventors:
TAKAI YUICHI (JP)
Application Number:
PCT/JP2017/000947
Publication Date:
September 14, 2017
Filing Date:
January 13, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO RUBBER IND (JP)
International Classes:
B29D30/46
Foreign References:
JP2011225152A2011-11-10
JPS5859830A1983-04-09
JP2007313791A2007-12-06
JP2000141510A2000-05-23
JPH06155632A1994-06-03
JPH01216796A1989-08-30
Other References:
See also references of EP 3427936A4
Attorney, Agent or Firm:
SUMITOMO Shintaro (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, PROGRAM, AND INFORMATION PROCESSING SY...

Next Patent: ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD...