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Patent Searching and Data


Title:
CUTTING DEVICE AND CUTTING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2018/020808
Kind Code:
A1
Abstract:
The present invention provides a cutting device and a cutting program that are able to cut a to-be-cut medium into a desired shape even when an angle formed between a main scanning direction and a sub-scanning direction deviates from a prescribed angle. This cutting device cuts a to-be-cut medium in accordance with cutting data that specifies a cutting position on the basis of a coordinate system defined by an X-axis and a Y-axis that are orthogonal to each other. The cutting device has a head which holds a cutter, and a movement mechanism that moves the to-be-cut medium relative to the head in X and Y directions. The cutting device forms a template on the basis of template cutting data (S21). The cutting device forms a straight folding line in the to-be-cut medium (S21). The cutting device specifies correction information according to a cutting hole (S23). The cutting device corrects the cutting data on the basis of a coordinate system defined by a corrected X-axis, which is obtained by correcting the angle of the X-axis on the basis of the correction information, and the Y-axis (S29).

Inventors:
ABE Daisuke (15-1Naeshiro-cho,Mizuho-ku,Nagoya-sh, Aichi 61, 〒4678561, JP)
KOBAYASHI Rino (15-1Naeshiro-cho,Mizuho-ku,Nagoya-sh, Aichi 61, 〒4678561, JP)
DOMEN Mitsuo (15-1Naeshiro-cho,Mizuho-ku,Nagoya-sh, Aichi 61, 〒4678561, JP)
Application Number:
JP2017/019522
Publication Date:
February 01, 2018
Filing Date:
May 25, 2017
Export Citation:
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Assignee:
BROTHER KOGYO KABUSHIKI KAISHA (15-1, Naeshiro-choMizuho-ku,Nagoya-sh, Aichi 61, 〒4678561, JP)
International Classes:
B26D5/00; B26D7/26
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