CUTTING DEVICE FOR SEPARATING INDIVIDUAL LAMINATED CHIP ASSEMBLIES FROM A STRIP THEREOF, METHOD OF SEPARATION AND A METHOD OF MAKING THE CUTTING DEVICE

Title:

CUTTING DEVICE FOR SEPARATING INDIVIDUAL LAMINATED CHIP ASSEMBLIES FROM A STRIP THEREOF, METHOD OF SEPARATION AND A METHOD OF MAKING THE CUTTING DEVICE

Document Type and Number:

WIPO Patent Application WO2003068450

Kind Code:

A3

Abstract:

An abrasive wheel (5) is used to separate individual laminated chips from a strip by cutting through the copper bridging elements (1). The abrasive wheel (5) is made up of abrasive particles bonded in a matrix having a high glass transition temperature and a cutting edge having a maximum thickness of the order of 350 micron, whereby the cut is substantially straight and free of smears and burrs.

More Like This:

JP2004090159	HEAT-RESISTANT RESIN BOND GRINDING WHEEL AND MANUFACTURING METHOD FOR IT
JP3927676	MANUFACTURE OF WIRE SAW AND WIRE SAW

Inventors:

TRICARD MARC J M
FISHER ROBERT
CORCORAN JR ROBERT F

Application Number:

PCT/US2003/002018

Publication Date:

December 24, 2003

Filing Date:

January 23, 2003

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SAINT GOBAIN ABRASIVES INC (US)

International Classes:

B24D3/28; B24D5/12; B27B5/34; B28D5/02; (IPC1-7): B24B1/00

Foreign References:

US5313742A	1994-05-24
US6056795A	2000-05-02
US6276355B1	2001-08-21
US3650715A	1972-03-21
US4142870A	1979-03-06

Download PDF:

View/Download PDF PDF Help

Previous Patent: MULTI-AXIS MACHINING CENTRE WITH A WORKPIECE-BEARING SPINDLE

Next Patent: TWO-LEG WALKING MOVING DEVICE