Title:
CUTTING DEVICE AND APPLIQUÉ SEWING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/129491
Kind Code:
A1
Abstract:
Provided are a cutting device and an appliqué sewing method with which a pattern and a base cloth can be aligned easily and accurately. A cutting device (1) acquires cutting data related to a selected pattern (S13). The cutting device (1) cuts the selected pattern from a processing cloth (20), along an outline, on the basis of the acquired cutting data (S15). The cutting device (1) then reads an image including a marker (110) affixed within the outline of the selected pattern, and acquires image data. The cutting device (1) identifies the position and angle of the marker (110) relative to the outline of the selected pattern, on the basis of the cutting data and the acquired image data, and generates positional relationship data (S21, S25). The positional relationship data are data in which information relating to the cutting data and to the identified position and angle are associated with one another.
Inventors:
IMAIZUMI KAZUTAKA (JP)
TOKURA MASASHI (JP)
TOKURA MASASHI (JP)
Application Number:
PCT/JP2016/053329
Publication Date:
August 18, 2016
Filing Date:
February 04, 2016
Export Citation:
Assignee:
BROTHER IND LTD (JP)
International Classes:
D05B19/04; D05B37/04
Foreign References:
| JPH08100363A | 1996-04-16 | |||
| JP2014064660A | 2014-04-17 | |||
| JP2014155579A | 2014-08-28 |
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