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Patent Searching and Data


Title:
CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/010303
Kind Code:
A1
Abstract:
A cutting device capable of accurately and stably cutting a cut material without impairing the quality of the cut member by preventing cracks from occurring therein. The cutting device (10) for cutting the material (W) to be cut, which is formed of a fragile material such as glass, ceramics, and semiconductor materials, comprises a cutting tool (12) disposed to come into contact with the specified cut portion (ω) of the material (W) and a displacement means for generating a relative motion between the cutting tool (12) and the material (W) along the cut portion (ω). The cutting tool (12) comprises a cutting blade part (18) having a blade tip part (20) (edge part) cutting the material (W) and a heating element heating the a cutting blade part (18) at a temperature higher than the softening point of the material (W). By generating the relative motion by a displacement means between the material (W) and the blade tip part (20) heated by the heating element, the cut portion (ω) of the material (W) can be cut off.

Inventors:
TAKITA MASAAKI (JP)
Application Number:
PCT/JP2006/316192
Publication Date:
January 24, 2008
Filing Date:
August 17, 2006
Export Citation:
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Assignee:
TAKITA RES & DEV CO LTD (JP)
TAKITA MASAAKI (JP)
International Classes:
B28D5/04
Foreign References:
JPH08276398A1996-10-22
JPH0388690U1991-09-10
JP2001079794A2001-03-27
Attorney, Agent or Firm:
OKADA, Masahiro (3rd Floor Iyo Building,2-21, Minamihonmachi 4-chome, Chuo-k, Osaka-shi Osaka 54, JP)
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