Title:
CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/092803
Kind Code:
A1
Abstract:
Provided is a cutting device wherein even if the spacing between a plurality of cutting blades is reduced, it is possible to prevent the cutting blades from falling over or performing improper cutting. Said cutting device (30) serves to cut a plate-like body in the direction in which the same is fed. This cutting device (30) is provided with a first mold (32) whereon are installed a plurality of cutting blades (34) that are disposed against one of the surfaces of the plate-like body and that have fixed sections (34b), the method of installing said plurality of cutting blades (34) being such that the fixed sections (34b) are mounted on the first mold (32); a second mold (44) whereon are installed a plurality of cutting blades (34) that are disposed against the other surface of the plate-like body, that cut the plate-like body in such way as to correspond to the plurality of cutting blades (34) installed on the first mold (32), and that have fixed sections (34b), the method of installing third said plurality of cutting blades (34) being such that third said fixed sections (34b) are mounted on the second mold (44); and a drive device which causes at least one of either the first mold (32) or the second mold (44) to come into contact with or separate from the other of either the first mold (32) or the second mold (44). Since the cutting blades (34) are installed on the first mold (32) and the second mold (44) by inserting fixed sections (34b), the cutting blades (34) have a plurality of insertion holes (38) wherein inner wall surfaces (37) and inner bottom surfaces (42) are formed, said inner wall surfaces (37) abutting the entire peripheries of the fixed sections (34b), and said inner bottom surfaces (42) being abutted by the bottom surfaces of the fixed sections (34b).
Inventors:
KIDO, Hisayoshi (Ebisu 3-chome Shibuya-k, Tokyo 13, 〒1500013, JP)
木藤 久義 (〒13 東京都渋谷区恵比寿３丁目２０番３号日高精機株式会社内 Tokyo, 〒1500013, JP)
木藤 久義 (〒13 東京都渋谷区恵比寿３丁目２０番３号日高精機株式会社内 Tokyo, 〒1500013, JP)
Application Number:
JP2010/050966
Publication Date:
August 04, 2011
Filing Date:
January 26, 2010
Export Citation:
Assignee:
HIDAKA SEIKI KABUSHIKI KAISHA (20-3, Ebisu 3-chome Shibuya-k, Tokyo 13, 〒1500013, JP)
日高精機株式会社 (〒13 東京都渋谷区恵比寿３丁目２０番３号 Tokyo, 〒1500013, JP)
KIDO, Hisayoshi (Ebisu 3-chome Shibuya-k, Tokyo 13, 〒1500013, JP)
日高精機株式会社 (〒13 東京都渋谷区恵比寿３丁目２０番３号 Tokyo, 〒1500013, JP)
KIDO, Hisayoshi (Ebisu 3-chome Shibuya-k, Tokyo 13, 〒1500013, JP)
International Classes:
B24B27/06; B23D15/06
Attorney, Agent or Firm:
WATANUKI, Takao (Cre-A Center Bldg, 12-9 Nakagosho 3-chom, Nagano-shi Nagano 35, 〒3800935, JP)
Claims: