Title:
CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/179499
Kind Code:
A1
Abstract:
Provided is a cutting device with which an object to be cut can be cut using conditions suitable for the object to be cut. In a cutting device provided with a platen, a mounting portion, a first movement mechanism, a second movement mechanism, a detector and a control portion, the control portion acquires cutting data (S1). The control portion moves the mounting portion relative to a holding member to a prescribed position (S2). The control portion acquires a position of contact at the prescribed position (S4). The control portion moves the mounting portion and the holding member relative to one another, to a cutting start position (S8). At the cutting start position, the control portion moves the mounting portion in a third direction as far as a cutting position set on the basis of the position of contact (S9, S10: YES, S11). The control portion controls the first movement mechanism in accordance with the cutting data to execute a cutting process to cut the object to be cut, using a cutting blade mounted on the mounting portion (S15).
More Like This:
| WO/2001/058653 | AUTOMATED CUTTING MACHINE |
Inventors:
SUGIYAMA KENTARO (JP)
NAKAMURA YOSHINORI (JP)
NIIZEKI TOMOYASU (JP)
NAKAMURA YOSHINORI (JP)
NIIZEKI TOMOYASU (JP)
Application Number:
PCT/JP2017/033252
Publication Date:
October 04, 2018
Filing Date:
September 14, 2017
Export Citation:
Assignee:
BROTHER IND LTD (JP)
International Classes:
B26D5/00
Foreign References:
| JP2002127092A | 2002-05-08 | |||
| JP2007136612A | 2007-06-07 | |||
| US5515758A | 1996-05-14 |
Download PDF: