Title:
CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/039328
Kind Code:
A1
Abstract:
A cutting device 100 comprises: a guide 11 which extends in the vertical direction; a cutting mechanism 12 which includes a cutting blade 121 and which can move in the vertical direction along the guide 11; a drive device 13 which moves the cutting mechanism 12 in the horizontal direction by moving the guide 11 in the horizontal direction; a pressing device 14 which presses the cutting mechanism 12 from above; and a receiving table 15 on which an object to be cut is mounted and which receives the cutting blade 121 during cutting of the object to be cut. During cutting of the object to be cut, the cutting mechanism 12 which is pressed by the pressing device 14 moves downward along the guide 11, and the object to be cut mounted on the receiving table 15 is cut by the cutting blade 121.
Inventors:
YAMAMOTO TAKESHI (JP)
KAMIGAWA HIDEYASU (JP)
SUMITA MASAYUKI (JP)
KAMIGAWA HIDEYASU (JP)
SUMITA MASAYUKI (JP)
Application Number:
PCT/JP2018/030120
Publication Date:
February 28, 2019
Filing Date:
August 10, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B26D7/26; B26D1/06; H01M50/406; B26D5/34; H01M10/04
Foreign References:
| US20100024503A1 | 2010-02-04 | |||
| JP2001088093A | 2001-04-03 | |||
| JP4418940B2 | 2010-02-24 |
Attorney, Agent or Firm:
NISHIZAWA, Hitoshi et al. (JP)
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