Title:
CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/188117
Kind Code:
A1
Abstract:
Provided is a cutting device that can cut an item to be cut, in accordance with parameters that are appropriate for said item to be cut. A control unit of this cutting device sets (S23, S24) a target location of a mounting unit in a third direction. The control unit controls a second movement mechanism and causes the mounting unit to move in the third direction. If it is determined (S25: YES) that the location of the mounting unit in the third direction has reached the target location, the control unit implements (S28, S29) a cutting process in accordance with cutting data, while controlling the second movement mechanism on the basis of a pressure-corresponding value for when the location of the mounting unit in the third direction is at the target location. If it is determined (S32: YES) that the pressure-corresponding value has reached a pressure threshold value, the control unit implements (S37, S38) the cutting process, while controlling the second movement mechanism on the basis of the pressure-corresponding value for when the location of the mounting unit in the third direction has moved to a location where the pressure-corresponding value is less than or equal to the pressure threshold value. The control unit resumes (S31, S41) control of the second movement mechanism.
Inventors:
SUGIYAMA KENTARO (JP)
Application Number:
PCT/JP2019/009310
Publication Date:
October 03, 2019
Filing Date:
March 08, 2019
Export Citation:
Assignee:
BROTHER IND LTD (JP)
International Classes:
B26D5/00; B26D5/24; B26D7/26; B26D7/28
Foreign References:
| JP2014008557A | 2014-01-20 | |||
| JP2002172590A | 2002-06-18 | |||
| JP2002127092A | 2002-05-08 |
Download PDF: