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Patent Searching and Data


Title:
CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/188117
Kind Code:
A1
Abstract:
Provided is a cutting device that can cut an item to be cut, in accordance with parameters that are appropriate for said item to be cut. A control unit of this cutting device sets (S23, S24) a target location of a mounting unit in a third direction. The control unit controls a second movement mechanism and causes the mounting unit to move in the third direction. If it is determined (S25: YES) that the location of the mounting unit in the third direction has reached the target location, the control unit implements (S28, S29) a cutting process in accordance with cutting data, while controlling the second movement mechanism on the basis of a pressure-corresponding value for when the location of the mounting unit in the third direction is at the target location. If it is determined (S32: YES) that the pressure-corresponding value has reached a pressure threshold value, the control unit implements (S37, S38) the cutting process, while controlling the second movement mechanism on the basis of the pressure-corresponding value for when the location of the mounting unit in the third direction has moved to a location where the pressure-corresponding value is less than or equal to the pressure threshold value. The control unit resumes (S31, S41) control of the second movement mechanism.

Inventors:
SUGIYAMA Kentaro (15-1 Naeshiro-cho, Mizuho-ku, Nagoya-sh, Aichi 61, 〒4678561, JP)
Application Number:
JP2019/009310
Publication Date:
October 03, 2019
Filing Date:
March 08, 2019
Export Citation:
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Assignee:
BROTHER KOGYO KABUSHIKI KAISHA (15-1, Naeshiro-cho Mizuho-ku, Nagoya-sh, Aichi 61, 〒4678561, JP)
International Classes:
B26D5/00; B26D5/24; B26D7/26; B26D7/28
Foreign References:
JP2014008557A2014-01-20
JP2002172590A2002-06-18
JP2002127092A2002-05-08
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