Title:
CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/019833
Kind Code:
A1
Abstract:
Provided is a cutting device capable of cutting an object to be cut under conditions which suit the object to be cut. The cutting device cuts an object 20 to be cut which is held by a holding member 10 by using a cutting blade Cs which is mounted to a mounting part. The cutting device determines a cutting pressure-corresponding value which corresponds to the pressure to be applied to the mounting part by a pressure-applying mechanism when cutting the object 20 to be cut using the cutting blade Cs, on the basis of a first pressure-corresponding value at the time when contact between the cutting blade Cs and the object 20 to be cut is detected while the mounting part is moving downward, and a second pressure-corresponding value at the time when arrival of the cutting blade Cs to the holding surface of the holding member 10 is detected. The cutting device moves the object 20 to be cut and the mounting part relative to one another on the basis of cutting data, and cuts the object 20 to be cut by using the cutting blade Cs mounted to the mounting part by applying pressure to the mounting part using the pressure-applying mechanism on the basis of the cutting pressure-corresponding value.
Inventors:
SUGIYAMA KENTARO (JP)
SHIKAMA YASUHITO (JP)
SHIKAMA YASUHITO (JP)
Application Number:
PCT/JP2020/012283
Publication Date:
February 04, 2021
Filing Date:
March 19, 2020
Export Citation:
Assignee:
BROTHER IND LTD (JP)
International Classes:
B26D5/00; B65H35/08
Domestic Patent References:
| WO2019188117A1 | 2019-10-03 |
Foreign References:
| JP2017109251A | 2017-06-22 | |||
| JP2018171669A | 2018-11-08 | |||
| JP2007136612A | 2007-06-07 | |||
| JPH05104497A | 1993-04-27 | |||
| JP2005246562A | 2005-09-15 |
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