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Patent Searching and Data


Title:
CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/001743
Kind Code:
A1
Abstract:
A cutting device, comprising: molds (5) provided with profile recesses (511) for mounting target object original sheets (9); a loading mechanism (4) comprising a rotating disk (41) for mounting the molds (5), the rotating disk (41) being used for driving the molds (5) to rotate; a feeding conveying line (1) used for conveying the target object original sheets (9) to a feeding preparation position; a feeding/discharging mechanism (3) used for taking away the target object original sheets (9) and placing same in the profile recesses (511) of the molds (5) according to the material state of the target object original sheets (9) conveyed to the feeding preparation position; and a cutting mechanism (6) used for cutting the target object original sheets (9) in the molds (5) rotating to the position, so as to obtain target object patches (10), wherein the feeding/discharging mechanism (3) is further used for taking away the target object patches (10) from the molds (5).

Inventors:
CHEN BINWEN (CN)
HUANG YUAN (CN)
YAN PING (CN)
LIU LONG (CN)
QU QIUYU (CN)
Application Number:
PCT/CN2023/099680
Publication Date:
January 04, 2024
Filing Date:
June 12, 2023
Export Citation:
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Assignee:
SUZHOU REVEDA MEDICAL BIOTECH CO LTD (CN)
International Classes:
B26D7/01; B26D5/12; B26D7/18; B26F1/38; B26F1/44; B65G47/52; B65G47/90
Foreign References:
CN217514038U2022-09-30
CN111227440A2020-06-05
CN107696150A2018-02-16
CN215094073U2021-12-10
CN216609315U2022-05-27
KR20110012986A2011-02-09
Attorney, Agent or Firm:
SHANGHAI SAVVY IP AGENCY CO., LTD. (CN)
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