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Patent Searching and Data


Title:
CUTTING DIE MANUFACTURING APPARATUS AND CUTTING DIE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/154641
Kind Code:
A1
Abstract:
The purpose of this invention is to make it possible to easily manufacture a cutting die which can position a cushion member at a suitable position on a die substrate, and with which the cost of the cutting die can be reduced. The cutting die manufacturing apparatus comprises: a stage (28) for setting a cutting die equipped with a die substrate having a cutting blade and a ruler blade embedded therewithin; an ejection device (31) equipped with nozzles (45a-45c) and an actuator; a drive unit for movement, for moving the stage and/or the ejection device; and a drive control unit (25) which performs control such that resin is discharged from the nozzles on the basis of molding data, and brings the cushion member, which has multiple cross sections, into proximity to a cutting blade, in a preset shaping pattern, thereby shaping the cushion member. Resin is discharged on the basis of shaping data, forming the cushion member comprising a plurality of profiles in the preset shaping pattern, making it possible to provide the cushion member in a suitable position on the die substrate.

Inventors:
KITAMOTO KOJI (JP)
JUNG IN BAE (JP)
Application Number:
PCT/JP2017/006493
Publication Date:
August 30, 2018
Filing Date:
February 22, 2017
Export Citation:
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Assignee:
SDS JAPAN CO LTD (JP)
KITAMOTO KOJI (JP)
International Classes:
B26F1/44
Domestic Patent References:
WO2011020518A12011-02-24
Foreign References:
JP2007021605A2007-02-01
JPH0768498A1995-03-14
JPH0517937U1993-03-05
Attorney, Agent or Firm:
KAWAI Makoto (JP)
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