Title:
CUTTING FLUID, CUTTING METHOD, AND SMOOTHNESS IMPROVER FOR CUT SURFACE
Document Type and Number:
WIPO Patent Application WO/2017/138570
Kind Code:
A1
Abstract:
[Problem] To provide: a cutting fluid which enables a material being cut to give cut surfaces having improved smoothness and which is effective in diminishing chipping, facilitates the recovery of abrasive grains, and has no fear about safety for the human body; a cutting method; and a smoothness improver for cut surfaces.
[Solution] A cutting fluid constituted of a sugar liquid which comprises any sugar alcohol(s) selected from among sorbitol, reduced starch syrups, and reduced maltose syrups and has a viscosity of 9.7 mPa·s or higher. According to the present invention, the cut surface can have improved smoothness and, hence, the polishing step which has conventionally been conducted after cutting can be shortened, simplified, or omitted to greatly contribute to an improvement in working efficiency. Furthermore, since chipping can be diminished, the present invention can greatly contribute to an improvement in the precision of the shape or dimensions of works or to an improvement in yield.
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Inventors:
IZUMI SHO (JP)
TOCHIO TAKUMI (JP)
SUWABE HITOSHI (JP)
TOCHIO TAKUMI (JP)
SUWABE HITOSHI (JP)
Application Number:
PCT/JP2017/004601
Publication Date:
August 17, 2017
Filing Date:
February 08, 2017
Export Citation:
Assignee:
B FOOD SCIENCE CO LTD (JP)
International Classes:
C10M173/02; B24B27/06; C10M105/14; C10M129/08; C10N30/06; C10N40/22
Foreign References:
| JP2002060777A | 2002-02-26 | |||
| JP2001164284A | 2001-06-19 | |||
| JP2012158670A | 2012-08-23 | |||
| JP2013534262A | 2013-09-02 |
Attorney, Agent or Firm:
SAGAWA Shingo et al. (JP)
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