CUTTING MACHINE AND CUTTING METHOD

WIPO Patent Application WO/2020/008780

A1

A cutting machine (1) that comprises a machine body (100) and an NC device (200). The NC device (200) has a tool diameter correction amount computation part (201), a processing path computation part (202), and a drive control part (203). The machine body (100) has a processing unit (104) and a tool path control part (300). When cutting tool information that is for altering a tool path (TP) during cutting is included in processing conditions (CP), the tool diameter correction amount computation part (201) recognizes a plurality of tool paths (TP) that are included in the processing conditions (CP) and generates tool diameter correction information (TC) that includes the plurality of tool paths (TP). The processing path computation part (202) generates a tool diameter correction control signal (TS) on the basis of a processing program (PP), the processing conditions (CP), and the tool diameter correction information (TC). On the basis of the tool diameter correction control signal (TS), the drive control part (203) generates a drive control signal (CS) for controlling the machine body (100).

JPH02258183	METHOD FOR FORMING MARKS OF KEY
JPS63301543	MANUFACTURE OF SEMICONDUCTOR ELEMENT
JP5120751	Bonding equipment

NAGAYAMA TAKEHIRO (JP)
KANNO KAZUHIRO (JP)

PCT/JP2019/022106

January 09, 2020

June 04, 2019

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AMADA HOLDINGS CO LTD (JP)

B23K26/00; B23K26/08; B23K26/082; B23K26/36; B23Q15/00; G05B19/4093

JPH0715179U	1995-03-14
JPH03155484A	1991-07-03
CA2725277A1	2011-06-17
CN103869748A	2014-06-18

MIYOSHI Hidekazu et al. (JP)

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