Title:
CUTTING MACHINE, SLITTER PROVIDED WITH SAME, AND METHOD FOR CUTTING FILM
Document Type and Number:
WIPO Patent Application WO/2011/118316
Kind Code:
A1
Abstract:
Disclosed is a cutting machine (10) that is provided with a suction roll (5) for suctioning film (9), and also provided with an irradiation apparatus (6) for cutting the film (9) by irradiating the film (9) with a laser beam. A plurality of vacuum holes (16) are formed on the suction roll (5), and the irradiation by laser beam from the irradiation apparatus (6) is directed toward the vacuum holes (16). The suction roll (5) is provided with an air suction apparatus for suctioning the film (9) to the surface (15) of the suction roll (5) by suctioning air through the vacuum holes (16).
Inventors:
MATSUMOTO RIKIYA
OIKAWA SHIN
OIKAWA SHIN
Application Number:
PCT/JP2011/053843
Publication Date:
September 29, 2011
Filing Date:
February 22, 2011
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
MATSUMOTO RIKIYA
OIKAWA SHIN
MATSUMOTO RIKIYA
OIKAWA SHIN
International Classes:
B23K26/10; B23K26/38; B23K26/40
Domestic Patent References:
| WO2010021025A1 | 2010-02-25 |
Foreign References:
| JP2000503596A | ||||
| JPH1147973A | 1999-02-23 | |||
| JP2007038281A | 2007-02-15 | |||
| JP2008034326A | 2008-02-14 |
Attorney, Agent or Firm:
HASEGAWA, Kazuya et al. (JP)
Kazuya Hasegawa (JP)
Kazuya Hasegawa (JP)
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Claims: