Title:
CUTTING MACHINE, CUTTING MACHINE FOR SUBSTRATE, AND CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/200000
Kind Code:
A1
Abstract:
Disclosed are a cutting machine (100), a cutting machine (100) for a substrate, and a cutting method. The cutting machine (100) comprises a plurality of positioning heads (110) and at least two sensors (120), wherein the plurality of positioning heads (110) position a product (170) to be cut, the plurality of positioning heads (110) are arranged on the cutting machine (100) in a row, and the at least two sensors (120) are respectively correspondingly arranged on two positioning heads (110), located at two ends, of the plurality of positioning heads (110) arranged in a row and detect position information of the product (170) to be cut. The cutting machine generates correction data for the plurality of positioning heads according to the position information, detected by the sensors, of the product to be cut, and controls the positioning position of each of the plurality of positioning heads to fix the product to be cut, thereby being able to improve the cutting accuracy and cutting automation.
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Inventors:
ZHANG HENG (CN)
Application Number:
PCT/CN2020/081054
Publication Date:
October 08, 2020
Filing Date:
March 25, 2020
Export Citation:
Assignee:
HKC CORP LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
B23Q15/24; B23Q15/22; B23Q17/22
Foreign References:
| CN110026804A | 2019-07-19 | |||
| CN104275627A | 2015-01-14 | |||
| CN104275627A | 2015-01-14 | |||
| DE102012006950A1 | 2013-10-10 | |||
| US20150343589A1 | 2015-12-03 | |||
| CN106363460A | 2017-02-01 |
Attorney, Agent or Firm:
SHENZHEN BAIRUI PATENT&TRADEMARK OFFICE (CN)
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