Title:
CUTTING MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/149501
Kind Code:
A1
Abstract:
The present invention makes it possible to appropriately adjust a light amount of a sensor in a more simplified procedure. A cutting machine 100 comprises: a calibration identification mark 290; a sensor 20 capable of reading the calibration identification mark 290; and a control device 110. The control device 110 comprises: a setting unit 122 for setting, to a predetermined target ratio R11, a light amount ratio R10 of the sensor 20; a movement control unit 124 for relatively moving the sensor 20 to which the light amount ratio R10 is set to the target ratio R11 in the movement direction, with respect to the calibration identification mark 290; a reading unit 126 for, when the sensor 20 is being relatively moved, reading a scanned waveform W1 of the calibration identification mark 290 by the sensor 20; and an adjustment unit 128 for calculating the target ratio R11 that results in a predetermined target reflectance R20, on the basis of the scanned waveform W1 and for determining the ratio as a setting light amount ratio R30.
Inventors:
FUJITA HIROTO (JP)
KANAZAWA TSUTOMU (JP)
SAGISAKA YUSUKE (JP)
KANAZAWA TSUTOMU (JP)
SAGISAKA YUSUKE (JP)
Application Number:
PCT/JP2023/003381
Publication Date:
August 10, 2023
Filing Date:
February 02, 2023
Export Citation:
Assignee:
DGSHAPE CORP (JP)
International Classes:
B23Q17/24; B23Q17/00
Foreign References:
| JP2021170230A | 2021-10-28 |
Attorney, Agent or Firm:
GOTOH Takashi (JP)
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