Title:
CUTTING METHOD AND CUTTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/162392
Kind Code:
A1
Abstract:
Disclosed is a cutting method whereby a board to be processed can be accurately cut with a simple configuration.
In the cutting method, an irradiation region (101) of a laser beam (100) is relatively moved along at least a part of a scribe line (12) formed on the surface (11) of a board to be processed (10), thereby cutting the board to be processed (10) in front of the irradiation region (101) by extending a crack (202) from the scribe line (12). In the method, irradiation intensity of the laser beam (100) is changed with time in a wave-like manner.
Inventors:
MATSUMOTO, Akinori (Limited 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
松本 彰則 (〒05 東京都千代田区有楽町一丁目１２番１号 旭硝子株式会社内 Tokyo, 〒1008405, JP)
FUKASAWA, Yasuji (Limited 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
松本 彰則 (〒05 東京都千代田区有楽町一丁目１２番１号 旭硝子株式会社内 Tokyo, 〒1008405, JP)
FUKASAWA, Yasuji (Limited 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
Application Number:
JP2011/064586
Publication Date:
December 29, 2011
Filing Date:
June 24, 2011
Export Citation:
Assignee:
ASAHI GLASS COMPANY, LIMITED (5-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 05, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区丸の内一丁目５番１号 Tokyo, 〒1008405, JP)
MATSUMOTO, Akinori (Limited 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
松本 彰則 (〒05 東京都千代田区有楽町一丁目１２番１号 旭硝子株式会社内 Tokyo, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区丸の内一丁目５番１号 Tokyo, 〒1008405, JP)
MATSUMOTO, Akinori (Limited 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
松本 彰則 (〒05 東京都千代田区有楽町一丁目１２番１号 旭硝子株式会社内 Tokyo, 〒1008405, JP)
International Classes:
C03B33/09; B23K26/00; B23K26/38; B23K26/40; B28D5/00
Attorney, Agent or Firm:
SENMYO, Kenji et al. (4th Floor, SIA Kanda Square 17, Kanda-konyacho, Chiyoda-k, Tokyo 35, 〒1010035, JP)
Claims: