Title:
CUTTING METHOD AND CUTTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/162392
Kind Code:
A1
Abstract:
Disclosed is a cutting method whereby a board to be processed can be accurately cut with a simple configuration.
In the cutting method, an irradiation region (101) of a laser beam (100) is relatively moved along at least a part of a scribe line (12) formed on the surface (11) of a board to be processed (10), thereby cutting the board to be processed (10) in front of the irradiation region (101) by extending a crack (202) from the scribe line (12). In the method, irradiation intensity of the laser beam (100) is changed with time in a wave-like manner.
Inventors:
MATSUMOTO AKINORI (JP)
FUKASAWA YASUJI (JP)
SATO YOSUKE (JP)
FUKASAWA YASUJI (JP)
SATO YOSUKE (JP)
Application Number:
PCT/JP2011/064586
Publication Date:
December 29, 2011
Filing Date:
June 24, 2011
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
MATSUMOTO AKINORI (JP)
FUKASAWA YASUJI (JP)
SATO YOSUKE (JP)
MATSUMOTO AKINORI (JP)
FUKASAWA YASUJI (JP)
SATO YOSUKE (JP)
International Classes:
C03B33/09; B23K26/00; B23K26/38; B23K26/40; B28D5/00
Domestic Patent References:
| WO2010074091A1 | 2010-07-01 |
Foreign References:
| JP2009196175A | 2009-09-03 | |||
| JPH0327768B2 | 1991-04-17 | |||
| JP2010145148A | 2010-07-01 |
Other References:
See also references of EP 2586751A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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Claims: