Title:
CUTTING METHOD FOR COMPOSITE FLOORING
Document Type and Number:
WIPO Patent Application WO/2010/048749
Kind Code:
A1
Abstract:
A cutting method for composite flooring is provided. The method involves cutting two sides of a floor substrate (1) separately by slotting tools (6, 7). One side of the floor substrate (1) is slotted with multiple parallel upper slots (2), and the other side of the floor substrate (1) is slotted with multiple parallel lower slots (3). The upper slots (2) are parallel with, though offset from, the lower slots (3), with each upper slot (2) and its adjacent lower slot (3) constituting a pair.
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Inventors:
SHEN, Dongliang (No. 76, XiaogangcunXingfu Village,Shengze, Wujiang, Jiangsu 8, 215228, CN)
Application Number:
CN2008/001884
Publication Date:
May 06, 2010
Filing Date:
November 17, 2008
Export Citation:
Assignee:
SHEN, Dongliang (No. 76, XiaogangcunXingfu Village,Shengze, Wujiang, Jiangsu 8, 215228, CN)
International Classes:
B27M3/04; B27F1/02; B27F5/00; E04F15/02
Attorney, Agent or Firm:
GMK INTELLECTUAL PROPERTY LTD. (Suite 308 & 309, Yuetan Tower2 Yuetan North Street,Xicheng District, Beijing 5, 100045, CN)
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