CUTTING METHOD AND CUTTING DEVICE

WIPO Patent Application WO/2011/142464

A1

Provided are a cutting method and a cutting device which achieve improved heating efficiency and cutting accuracy and can easily correspond to the design change of a planned cut line. Specifically provided is a cutting method for cutting a plate to be processed (10) by irradiating the surface (11) of the plate to be processed (10) with first and second infrared light (43, 44) and moving the irradiation regions (100, 200) thereof along a planned cut line (12) of the surface (11). In a predetermined region of the surface (11), the width (W1) in the direction orthogonal to the direction of movement of the first infrared light (43) is set smaller than the width (W2) in the direction orthogonal to the direction of movement of the second infrared light (44), and the irradiation region (100) of the first infrared light (43) is moved in linkage with the irradiation region (200) of the second infrared light (44) that travels ahead. Consequently, the method can achieve improvements in the heating efficiency and the cutting accuracy, and easily correspond to the design change of the planned cut line.

JP3108131	LASER BEAM MACHINE
JP2003136265	LASER BEAM MACHINING METHOD AND DEVICE, AND ELECTRONIC DEVICE
WO/2012/023798	STAGE FOR LASER PROCESSING

SAITO, Isao (Limited 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)

JP2011/061075

November 17, 2011

May 13, 2011

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ASAHI GLASS COMPANY, LIMITED (5-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 05, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区丸の内一丁目５番１号 Tokyo, 〒1008405, JP)

B23K26/38; B23K26/00; B23K26/06; B23K26/40; B23K26/42; B28D5/00; C03B33/09

SENMYO, Kenji et al. (4th Floor, SIA Kanda Square17, Kanda-konyach, Chiyoda-ku Tokyo 35, 〒1010035, JP)

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