Title:
CUTTING METHOD FOR REINFORCED GLASS PLATE AND REINFORCED GLASS PLATE CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/031778
Kind Code:
A1
Abstract:
The present invention relates to a cutting method for a reinforced glass plate (10). The reinforced glass plate (10), which has a front surface layer (13) and a back surface layer (15) having residual compressive stress and also has an intermediate layer (17) having internal residual tensile stress formed between the front surface layer (13) and the back surface layer (15) is cut by moving an irradiation region (22) of laser light. Furthermore, when the cutting of the reinforced glass plate (10) is started, thermal stress that induces the occurrence of a crack is exerted on the starting position for cutting, and after generating a crack in the starting position for cutting and simultaneously inhibiting elongation of the crack, cutting of the reinforced glass plate (10) is carried out while inhibiting elongation of the crack by the internal residual tensile stress of the intermediate layer (17).
Inventors:
SAITO ISAO (JP)
IWANAGA YASUNARI (JP)
IWANAGA YASUNARI (JP)
Application Number:
PCT/JP2012/071719
Publication Date:
March 07, 2013
Filing Date:
August 28, 2012
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
SAITO ISAO (JP)
IWANAGA YASUNARI (JP)
SAITO ISAO (JP)
IWANAGA YASUNARI (JP)
International Classes:
B23K26/00; C03B33/09; B23K26/38; B28D5/00; C03C21/00
Domestic Patent References:
| WO2008108332A1 | 2008-09-12 | |||
| WO2012096053A1 | 2012-07-19 | |||
| WO2012096285A1 | 2012-07-19 |
Foreign References:
| JP2006256944A | 2006-09-28 |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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Claims: