Title:
CUTTING METHOD FOR WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2010/143354
Kind Code:
A1
Abstract:
In a cutting method for a workpiece wherein a cylindrical workpiece is pressed against rows of wire which are formed by winding a wire spirally between a plurality of wire guides and the workpiece is cut into wafers by moving the wire while supplying a slurry to contact portions between the workpiece and the wire, the workpiece is heated prior to the cutting operation to a temperature above a temperature of the slurry to be supplied, at the time when the cutting operation begins and below the maximum temperature which the workpiece reaches during the cutting operation of the workpiece, and thereafter, the workpiece is cut. Thus, in a cutting method for a cylindrical workpiece using a wire saw, a workpiece cutting method which can simply and effectively suppress the occurrence of warp is provided.
More Like This:
| JPH0639095 | INDUSTRIAL APPLICABILITY: A device for cutting a brittle material. |
| JP2023081008 | PROCESSING DEVICE AND DETERMINATION METHOD OF WORKPIECE |
| JP2015214002 | CUTTING METHOD |
Inventors:
TOMII KAZUYA (JP)
KITAGAWA KOJI (JP)
KITAGAWA KOJI (JP)
Application Number:
PCT/JP2010/003108
Publication Date:
December 16, 2010
Filing Date:
May 06, 2010
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
TOMII KAZUYA (JP)
KITAGAWA KOJI (JP)
TOMII KAZUYA (JP)
KITAGAWA KOJI (JP)
International Classes:
B24B27/06; B24B55/02; B28D5/04; H01L21/304
Domestic Patent References:
| WO2005039824A1 | 2005-05-06 |
Foreign References:
| JP2008078473A | 2008-04-03 | |||
| JP2006192555A | 2006-07-27 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good 宮幹夫 (JP)
Good 宮幹夫 (JP)
Download PDF: