Title:
CUTTING AND POLISHING INTEGRATED APPARATUS FOR CRYSTAL PROCESSING
Document Type and Number:
WIPO Patent Application WO/2021/184583
Kind Code:
A8
Abstract:
A cutting and polishing integrated apparatus for crystal processing, which comprises a rack (1). A cutting frame (2) is disposed on the rack (1); a lifting plate (3) is disposed on the cutting frame (2), and a first lifting cylinder (4) is mounted on the lifting plate (3); both sides of the lifting plate (3) are provided with first ball screws (6); each first ball screw (6) is provided with an arc-shaped pressing block (7) and a first servo motor (8); both sides of the lifting plate (3) are provided with wire take-up and pay-off devices (9), and a cutting line is connected between the two wire take-up and pay-off devices (9); a swinging wire wheel (10) is mounted at the bottom of the lifting plate (3); the two sides of the cutting frame (2) are respectively provided with a pushing device (11) and a polishing frame (12); a second lifting cylinder (14) is mounted on the polishing frame (12); the second lifting cylinder (14) is connected to a variable-speed drive device (15), an exhaust device (16), and a polishing wheel (17). The apparatus not only can reduce the labor intensity, but also has the advantages of small occupied floor area, good cutting effect, high working efficiency, wide application range, long service life, convenience in cleaning, high stability, convenience in use, high polishing precision, and low production cost.
Inventors:
YAN DONGFANG (CN)
Application Number:
PCT/CN2020/099154
Publication Date:
November 04, 2021
Filing Date:
June 30, 2020
Export Citation:
Assignee:
YAN DONGFANG (CN)
International Classes:
B28D5/04
Attorney, Agent or Firm:
HANGZHOU XINYUAN PATENT AGENCY (CN)
Download PDF: